BGA microcircuits today represent one of the most complex and versatile electronic components. Every day they displace components in QFP, TQFP and other housings from the board. All this happens because to date the BGA case is the most consummate and beats others in several respects:

 

• Mounting density
• Thermal conductivity
• resistance to interference.

 

However, with all their advantages, BGA microcircuits can cause a daily headache for technicians and engineers specializing in electronic equipment repair, making them very difficult to replace in the event of a failure. And it turns out that for various reasons such failures are very frequent in modern equipment, especially in cell phones and laptops. Hence, the requirement arises for those who specialize in BGA Repair and Replacement.