American Semiconductor is a prominent developer and manufacturer of ultra-thin chip technology and production, serving the semiconductor industry as well as allied industries. Chip-on-flex, protected fan-in, heterogeneous integration, and multi-chip packing are just a few of the thin device applications that the business created and provides Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for. For thin-device technology, the company offers design, assembly, test, and bespoke engineering services. American Semiconductor offers trustworthy, high-efficiency advanced packaging, assembly, and testing of thin electronics as a provider of advanced packaging and assembly. WLCSP fabrication, assembly, and test procedures are carried out at American Semiconductor's 9,000 square foot facility, which has its headquarters in Boise, Idaho.