We develop, produce and sell plating chemicals and equipment for manufacturing printed circuit boards, package substrates, semiconductors, leadframes and connectors and are recognized as the leading innovator within the electronics plating industry.

The trends towards better connectivity, greater device functionality, performance, and miniaturization, are leading to higher complexity in our customers’ products, which require advanced technology solutions more than ever before.

Today we serve global manufacturers with leading horizontal equipment and wet chemical process technology in the areas of surface treatment, metallization, electrolytic plating, final finishes, as well as pad metallization, copper pillar, RDL, TSV, and dual damascene plating. Our comprehensive portfolio, consisting of horizontal and vertical processes, allows us to participate in various future growth areas, such as next-generation smartphones, electrical and autonomous vehicles, the Internet of things, 5G, virtual reality, and artificial intelligence.