To meet every need, Avantec offers its clients surface mount (SMT), ball grid array (BGA), through-hole, or mixed technology services. Equipment from Philips* and Amistar's automatic pick-and-place lines makes up our surface mount product line. The Electrovert Econopack Wave Soldering System is used to solder each and every through-hole assembly. The de-ionized aqueous water cleaning method can be utilized to clean all of the products because all of the fluxes used in our assembly processes are water soluble.

Consignment and full turnkey agreements are also available from Avantec to meet the needs of our clients. First-in-first-out (FIFO) inventory control is managed by our MRP system. All customer-owned parts are kept in a bonded stockroom on the premises.