Concerns around floor layout, design, testing, and bandwidth management have all been problems for System-In-Package type integration. All of these restrictions are removed by IIC's cutting-edge Quilt Packaging technology, which also achieves genuine heterogeneous integration and can produce device performance similar to that of a monolith.Two researchers from the University of Notre Dame founded Indiana Integrated Circuits, LLC (IIC) with the goal of commercializing Quilt Packaging (QP), a cutting-edge microchip connection and packaging technology. The IIC team collaborates directly with clients and partners to provide application-specific solutions for licensees, conducts proof-of-concept prototyping, and supports the integration of QP into current process flows. 

The unique technique of IIC provides designers with unparalleled alternatives for microchip integration, made possible by the sub-micron chip-to-chip alignment and ultra-low-loss qualities of Quilt Packaging interconnections.