Since 1986, Lintek has been developing and perfecting its patented high vacuum deposition method, going through three different metaliser technology stages.

Using a conveyor system to move individual panels into and out of the vapour deposition chamber, our process vaporises high purity copper onto the surface and through the holes of different substrates. The panel is then rotated to coat the second side before returning to the conveyor to move onto the next process step.