On Connecticut's picturesque shoreline, Argo was established in 1969 as a maker of contract electronics assembly. We have led the field in circuit miniaturization technologies from the beginning. Our initial products were high-density resistor networks for scientific research applications at universities and other research institutions. From these networks, thick and thin film ceramic hybrid circuit assemblies were a natural growth step.

In the mid 1970s we helped pioneer a new technology called Chip On Board (COB) and various Multi Chip Module (MCM) designations. COB formed the initial basic step that led to today’s Ball Grid Array (BGA) technology. In 1975, Argo became involved in the design and manufacture of high quality miniaturized electronic circuits for a broad range of industries.

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