For both wafer sort and final test applications, we at R&D Altanova are experts in providing cutting-edge test interface solutions. Our solutions include comprehensive component and mechanical assembly, sophisticated fabrication capabilities (probe cards, load board PCBs, and MLO substrates), advanced in-house design and simulation (SI/PI), and advanced fabrication capabilities.

Many of the biggest integrated device manufacturers, fabless semiconductor businesses, and semiconductor foundries rely on R&D Altanova as their primary source for complete turn-key test interface solutions.

Burn-in boards, probe cards with coplanarity requirements as low as 12 m, fine pitch load boards with manufacturing down to 0.2 mm, embedded component solutions for printed circuit boards, and daughter cards are just a few examples of cutting-edge technology solutions for the ATE industry.

R&D Altanova employs a variety of exclusive technologies and procedures to